Inventor

CORDES STEVEN A

US49 patents

⚠️ This page may combine multiple inventors who share the name “CORDES STEVEN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CORDES STEVEN A

IBM

Etched glass solder bump transfer for flip chip integrated circuit devices

Integrated coil inductors for IC devices

Etched glass solder bump transfer for flip chip integrated circuit devices

Hybrid molds for molten solder screening process

Thermoelectric coolers with enhanced structured interfaces

Method for forming three-dimensional circuitization and circuits formed

Global vacuum injection molded solder system and method

High Q inductor with faraday shield and dielectric well buried in substrate

Method of fabricating integrated coil inductors for IC devices

High Q inductor with faraday shield and dielectric well buried in substrate

Hybrid molds for molten solder screening process

Guides lithographically fabricated on semiconductor devices

Method of producing coaxial solder bump connections using injection molding of solder

High-temperature alloy standoffs for injection molding of solder

Rotational fill techniques for injection molding of solder

Fill head for injection molding of solder

Responding to personal danger using a mobile electronic device

Methods and systems involving text analysis

Conductive bonding material fill techniques

Fabrication of high resolution aluminum ablation masks

Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology

Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology

Rotational fill techniques for injection molding of solder

Fill head for injection molding of solder

Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof

Interposer structures and methods of manufacturing the same

Flexible capacitive coupler assembly and method of manufacture

Processing for overcoming extreme topography

Substrate via filling

Substrate via filling

Processing for overcoming extreme topography

Solder standoffs for injection molding of solder

Conductive bonding material fill techniques

Detecting personal danger using a deep learning system

Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology

Alignment of integrated circuit chip stack

Flow-directed collaborative communication

Flow-directed collaborative communication

Flow-directed collaborative communication

Flow-directed collaborative communication

Flow-directed collaborative communication

Universal mold for injection molding of solder

Organic probe substrate

CORDES STEVEN A

Direct edge connection for multi-chip integrated circuits

Direct edge connection for multi-chip integrated circuits

Interposer structures and methods of manufacturing the same

AUDETTE DAVID M

Probe-on-substrate

Probe-on-substrate

COHEN GUY A

Processing for overcoming extreme topography