Inventor
LIPSCHUTZ LEWIS D
US7 patents
Patents
7 patentsUS4498530AFeb 12, 1985
Flexible thermal conduction element for cooling semiconductor devices
IBM75 citations94
US4442450AApr 10, 1984
Cooling element for solder bonded semiconductor devices
IBM59 citations92
US4483389ANov 20, 1984
Telescoping thermal conduction element for semiconductor devices
IBM31 citations90
US4500945AFeb 19, 1985
Directly sealed multi-chip module
IBM24 citations80
US4747533AMay 31, 1988
Bonding method and apparatus
IBM12 citations71
US4611746ASep 16, 1986
Process for forming improved solder connections for semiconductor devices with enhanced fatigue life
IBM5 citations61
US4805831AFeb 21, 1989
Bonding method
IBM2 citations60