Inventor
LABONTE ANDRE P
US30 patents
⚠️ This page may combine multiple inventors who share the name “LABONTE ANDRE P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS9397049B1Jul 19, 2016
Gate tie-down enablement with inner spacer
IBM25 citations98
US9735054B2Aug 15, 2017
Gate tie-down enablement with inner spacer
IBM4 citations84
US9570397B1Feb 14, 2017
Local interconnect structure including non-eroded contact via trenches
IBM7 citations84
US10879375B2Dec 29, 2020
Gate tie-down enablement with inner spacer
IBM1 citations73
US10832961B1Nov 10, 2020
Sacrificial gate spacer regions for gate contacts formed over the active region of a transistor
IBM1 citations63
US9627257B2Apr 18, 2017
Gate tie-down enablement with inner spacer
IBM1 citations63
US10522654B2Dec 31, 2019
Gate tie-down enablement with inner spacer
IBM0 citations52
US10388602B2Aug 20, 2019
Local interconnect structure including non-eroded contact via trenches
IBM0 citations52
US10332977B2Jun 25, 2019
Gate tie-down enablement with inner spacer
IBM0 citations52
US10128352B2Nov 13, 2018
Gate tie-down enablement with inner spacer
IBM0 citations52
US9941163B2Apr 10, 2018
Gate tie-down enablement with inner spacer
IBM0 citations52
US9929049B2Mar 27, 2018
Gate tie-down enablement with inner spacer
IBM0 citations52
US9899259B2Feb 20, 2018
Gate tie-down enablement with inner spacer
IBM0 citations52
GLOBALFOUNDRIES INC
5 patentsUS9947589B1Apr 17, 2018
Methods of forming a gate contact for a transistor above an active region and the resulting device
GLOBALFOUNDRIES INC8 citations84
US9640625B2May 2, 2017
Self-aligned gate contact formation
GLOBALFOUNDRIES INC8 citations83
US10790376B2Sep 29, 2020
Contact structures
GLOBALFOUNDRIES INC2 citations73
US10204994B2Feb 12, 2019
Methods of forming a semiconductor device with a gate contact positioned above the active region
GLOBALFOUNDRIES INC4 citations73
US10832944B2Nov 10, 2020
Interconnect structure having reduced resistance variation and method of forming same
GLOBALFOUNDRIES INC0 citations52
NAT SEMICONDUCTOR CORP
4 patentsUS7968418B1Jun 28, 2011
Apparatus and method for isolating integrated circuit components using deep trench isolation and shallow trench isolation
NAT SEMICONDUCTOR CORP8 citations80
US7829429B1Nov 9, 2010
Semiconductor device having localized insulated block in bulk substrate and related method
NAT SEMICONDUCTOR CORP2 citations61
US7781295B1Aug 24, 2010
System and method for providing a single deposition emitter/base in a bipolar junction transistor
NAT SEMICONDUCTOR CORP4 citations61
US8007675B1Aug 30, 2011
System and method for controlling an etch process for a single crystal having a buried layer
NAT SEMICONDUCTOR CORP2 citations59
APPLIED MATERIALS INC
4 patentsUS11112694B2Sep 7, 2021
Methods of forming variable-depth device structures
APPLIED MATERIALS INC5 citations73
US12158605B2Dec 3, 2024
Method for manufacturing optical device structures
APPLIED MATERIALS INC0 citations61
US12013566B2Jun 18, 2024
Method for manufacturing optical device structures
APPLIED MATERIALS INC0 citations61
US11487058B2Nov 1, 2022
Method for manufacturing optical device structures
APPLIED MATERIALS INC0 citations61
LABONTE ANDRE P
3 patentsUS8507375B1Aug 13, 2013
Alignment tolerant semiconductor contact and method
LABONTE ANDRE P8 citations82
US8580628B2Nov 12, 2013
Integrated circuit contact structure and method
LABONTE ANDRE P4 citations61
US8502296B1Aug 6, 2013
Non-volatile memory cell with asymmetrical split gate and related system and method
LABONTE ANDRE P0 citations33