Inventor
BOETTCHER STEVEN H
US9 patents
Patents
9 patentsUS6123825ASep 26, 2000
Electromigration-resistant copper microstructure and process of making
IBM85 citations96
US6911229B2Jun 28, 2005
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof
IBM20 citations92
US6572982B1Jun 3, 2003
Electromigration-resistant copper microstructure
IBM15 citations92
US6416812B1Jul 9, 2002
Method for depositing copper onto a barrier layer
IBM20 citations92
US6383929B1May 7, 2002
Copper vias in low-k technology
IBM17 citations84
US7560692B2Jul 14, 2009
Method of TEM sample preparation for electron holography for semiconductor devices
IBM2 citations59
US7214935B2May 8, 2007
Transmission electron microscopy sample preparation method for electron holography
IBM3 citations59
US12274966B2Apr 15, 2025
Filter device having multiple changeable filter surfaces
IBM0 citations55
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51