Inventor
FULLER JR JAMES W
US14 patents
⚠️ This page may combine multiple inventors who share the name “FULLER JR JAMES W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENDICOTT INTERCONNECT TECH INC
9 patentsUS6809269B2Oct 26, 2004
Circuitized substrate assembly and method of making same
ENDICOTT INTERCONNECT TECH INC36 citations96
US7071423B2Jul 4, 2006
Circuitized substrate assembly and method of making same
ENDICOTT INTERCONNECT TECH INC8 citations74
US7047630B2May 23, 2006
Method of making circuitized substrate assembly
ENDICOTT INTERCONNECT TECH INC6 citations74
US6900392B2May 31, 2005
Information handling system utilizing circuitized substrate
ENDICOTT INTERCONNECT TECH INC4 citations74
US6872894B2Mar 29, 2005
Information handling system utilizing circuitized substrate
ENDICOTT INTERCONNECT TECH INC5 citations74
US7163847B2Jan 16, 2007
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC2 citations59
US7084014B2Aug 1, 2006
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC3 citations59
US7343674B2Mar 18, 2008
Method of making circuitized substrate assembly
ENDICOTT INTERCONNECT TECH INC0 citations52
US7091066B2Aug 15, 2006
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC0 citations49
IBM
5 patentsUS6407341B1Jun 18, 2002
Conductive substructures of a multilayered laminate
IBM138 citations97
US6781064B1Aug 24, 2004
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
IBM16 citations92
US5981880ANov 9, 1999
Electronic device packages having glass free non conductive layers
IBM33 citations92
US6529379B1Mar 4, 2003
Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
IBM21 citations91
US6832436B2Dec 21, 2004
Method for forming a substructure of a multilayered laminate
IBM8 citations72