Inventor
MAEDA TAKEHIKO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “MAEDA TAKEHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
6 patentsUS7911038B2Mar 22, 2011
Wiring board, semiconductor device using wiring board and their manufacturing methods
RENESAS ELECTRONICS CORP7 citations84
US9853005B2Dec 26, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP2 citations71
US10181450B2Jan 15, 2019
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP1 citations61
US9659888B2May 23, 2017
Semiconductor device
RENESAS ELECTRONICS CORP0 citations49
US9299632B2Mar 29, 2016
Semiconductor device
RENESAS ELECTRONICS CORP0 citations49
US11270971B2Mar 8, 2022
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations45
NEC ELECTRONICS CORP
5 patentsUS6762488B2Jul 13, 2004
Light thin stacked package semiconductor device and process for fabrication thereof
NEC ELECTRONICS CORP222 citations98
US7745736B2Jun 29, 2010
Interconnecting substrate and semiconductor device
NEC ELECTRONICS CORP15 citations84
US7649749B2Jan 19, 2010
Wiring substrate, semiconductor device, and method of manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
US7701726B2Apr 20, 2010
Method of manufacturing a wiring substrate and semiconductor device
NEC ELECTRONICS CORP1 citations52
NEC CORP
4 patentsUS7838779B2Nov 23, 2010
Wiring board, method for manufacturing same, and semiconductor package
NEC CORP16 citations84
US8035217B2Oct 11, 2011
Semiconductor device and method for manufacturing same
NEC CORP9 citations83
US7999401B2Aug 16, 2011
Semiconductor device and method of manufacturing same
NEC CORP6 citations62
US8043953B2Oct 25, 2011
Semiconductor device including an LSI chip and a method for manufacturing the same
NEC CORP1 citations51