Inventor

DAHILIG FREDERICK RODRIGUEZ

SG8 patents

⚠️ This page may combine multiple inventors who share the name “DAHILIG FREDERICK RODRIGUEZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents

US7830020B2Nov 9, 2010

Integrated circuit package system employing device stacking

STATS CHIPPAC LTD19 citations92

US8022539B2Sep 20, 2011

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

STATS CHIPPAC LTD9 citations84

US8344495B2Jan 1, 2013

Integrated circuit packaging system with interconnect and method of manufacture thereof

STATS CHIPPAC LTD9 citations83

DAHILIG FREDERICK RODRIGUEZ

2 patents

US8174127B2May 8, 2012

Integrated circuit package system employing device stacking

DAHILIG FREDERICK RODRIGUEZ1 citations48

US8120187B2Feb 21, 2012

Integrated circuit package system employing device stacking and method of manufacture thereof

DAHILIG FREDERICK RODRIGUEZ1 citations48

CAMACHO ZIGMUND RAMIREZ

1 patent

US8810015B2Aug 19, 2014

Integrated circuit packaging system with high lead count and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ7 citations83

LEE JAE SOO

1 patent

US8405230B2Mar 26, 2013

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

LEE JAE SOO11 citations82

BATHAN HENRY DESCALZO

1 patent

US8937393B2Jan 20, 2015

Integrated circuit package system with device cavity

BATHAN HENRY DESCALZO0 citations51