Inventor
MUN KYUNGDON
KR15 patents
Patents
15 patentsUS11581284B2Feb 14, 2023
Semiconductor package with under-bump metal structure
SAMSUNG ELECTRONICS CO LTD4 citations73
US11626367B2Apr 11, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations72
US11569175B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US12094817B2Sep 17, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12040297B2Jul 16, 2024
Methods of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations61
US11942434B2Mar 26, 2024
Method of manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11342274B2May 24, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12119305B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11398420B2Jul 26, 2022
Semiconductor package having core member and redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12482721B2Nov 25, 2025
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations58
US12159826B2Dec 3, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11538737B2Dec 27, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12538848B2Jan 27, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12581948B2Mar 17, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12588500B2Mar 24, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41