Inventor

LEE GONGJE

KR5 patents

Patents

5 patents

US11569175B2Jan 31, 2023

Semiconductor package

SAMSUNG ELECTRONICS CO LTD5 citations72

US12119305B2Oct 15, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations60

US11398420B2Jul 26, 2022

Semiconductor package having core member and redistribution substrate

SAMSUNG ELECTRONICS CO LTD0 citations60

US12463125B2Nov 4, 2025

Semiconductor package including post

SAMSUNG ELECTRONICS CO LTD0 citations59

US12525526B2Jan 13, 2026

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations49