Inventor
CHEN WEIMING CHRIS
TW21 patents
Patents
21 patentsUS10319699B2Jun 11, 2019
Chip package having die structures of different heights
TAIWAN SEMICONDUCTOR MFG CO LTD21 citations94
US10510722B2Dec 17, 2019
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10304800B2May 28, 2019
Packaging with substrates connected by conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US11508696B2Nov 22, 2022
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11462418B2Oct 4, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11380611B2Jul 5, 2022
Chip-on-wafer structure with chiplet interposer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10515869B1Dec 24, 2019
Semiconductor package structure having a multi-thermal interface material structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11164855B2Nov 2, 2021
Package structure with a heat dissipating element and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72
US11728238B2Aug 15, 2023
Semiconductor package with heat dissipation films and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11139282B2Oct 5, 2021
Semiconductor package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12564057B2Feb 24, 2026
Chiplet interposer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400878B2Aug 26, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322729B2Jun 3, 2025
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148719B2Nov 19, 2024
Forming large chips through stitching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062590B2Aug 13, 2024
Method for manufacturing semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11996371B2May 28, 2024
Chiplet interposer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11444038B2Sep 13, 2022
Forming large chips through stitching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327781B2Jun 10, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12315786B2May 27, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12027455B2Jul 2, 2024
Chip-on-wafer structure with Chiplet Interposer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10515906B2Dec 24, 2019
Forming large chips through stitching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52