Inventor
TAI SHIH-HSI
TW3 patents
Patents
3 patentsUS11469154B2Oct 11, 2022
IGBT module with heat dissipation structure having specific layer thickness ratio
AMULAIRE THERMAL TECH INC0 citations55
US11388811B1Jul 12, 2022
Heat-dissipating substrate structure with built-in conductive circuits
AMULAIRE THERMAL TECH INC0 citations55
US11895778B2Feb 6, 2024
Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer
AMULAIRE THERMAL TECH INC0 citations51