Inventor
YAMAGATA SHIN-ICHI
JP10 patents
Patents
10 patentsUS6280496B1Aug 28, 2001
Silicon carbide based composite material and manufacturing method thereof
SUMITOMO ELECTRIC INDUSTRIES42 citations92
US6507105B1Jan 14, 2003
Member for semiconductor device and method for producing the same
SUMITOMO ELECTRIC INDUSTRIES20 citations91
US6123895ASep 26, 2000
Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same
SUMITOMO ELECTRIC INDUSTRIES24 citations91
US5828127AOct 27, 1998
Semiconductor substate with improved thermal conductivity
SUMITOMO ELECTRIC INDUSTRIES46 citations91
US5533930AJul 9, 1996
Apparatus for producing a silicon nitride sintered body
SUMITOMO ELECTRIC INDUSTRIES17 citations73
US7180178B2Feb 20, 2007
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES7 citations72
US5605558AFeb 25, 1997
Nitrogenous aluminum-silicon powder metallurgical alloy
SUMITOMO ELECTRIC INDUSTRIES3 citations62
US12451407B2Oct 21, 2025
Composite material, semiconductor package, and method of manufacturing composite material
SUMITOMO ELECTRIC INDUSTRIES0 citations61
US12525503B2Jan 13, 2026
Composite material, heat spreader and semiconductor package
SUMITOMO ELECTRIC INDUSTRIES0 citations51
US6979901B2Dec 27, 2005
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES1 citations51