Inventor
LIN CHI-FA
TW13 patents
Patents
13 patentsUS5920792AJul 6, 1999
High density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layers
WINBOND ELECTRONICS CORP285 citations98
US6277757B1Aug 21, 2001
Methods to modify wet by dry etched via profile
WINBOND ELECTRONICS CORP107 citations97
US6477447B1Nov 5, 2002
Methods to generate numerical pressure distribution data for developing pressure related components
WINBOND ELECTRONICS CORP34 citations92
US6307268B1Oct 23, 2001
Suppression of interconnect stress migration by refractory metal plug
WINBOND ELECTRONICS CORP22 citations92
US6180997B1Jan 30, 2001
Structure for a multi-layered dielectric layer and manufacturing method thereof
WINBOND ELECTRONICS CORP21 citations92
US5969409AOct 19, 1999
Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein
WINBOND ELECTRONICS CORP28 citations92
US5946592AAug 31, 1999
Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein
WINBOND ELECTRONICS CORP18 citations92
US6235608B1May 22, 2001
STI process by method of in-situ multilayer dielectric deposition
WINBOND ELECTRONICS CORP19 citations91
US6165886ADec 26, 2000
Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect
WINBOND ELECTRONICS CORP26 citations91
US6441465B2Aug 27, 2002
Scribe line structure for preventing from damages thereof induced during fabrication
WINBOND ELECTRONICS CORP19 citations82
US6033987AMar 7, 2000
Method for mapping and adjusting pressure distribution of CMP processes
WINBOND ELECTRONICS CORP18 citations78
US6323122B2Nov 27, 2001
Structure for a multi-layered dielectric layer and manufacturing method thereof
WINBOND ELECTRONICS CORP1 citations51
US6204551B1Mar 20, 2001
Modified SOG coater's hot plate to improve SOG film quality
WINBOND ELECTRONICS CORP1 citations51