Inventor
YANG SE YOUNG
US20 patents
⚠️ This page may combine multiple inventors who share the name “YANG SE YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSAS CORP
6 patentsUS9041227B2May 26, 2015
Package-on-package assembly with wire bond vias
INVENSAS CORP37 citations97
US9761558B2Sep 12, 2017
Package-on-package assembly with wire bond vias
INVENSAS CORP4 citations84
US11189595B2Nov 30, 2021
Package-on-package assembly with wire bond vias
INVENSAS CORP0 citations62
US9252122B2Feb 2, 2016
Package-on-package assembly with wire bond vias
INVENSAS CORP2 citations62
US10756049B2Aug 25, 2020
Package-on-package assembly with wire bond vias
INVENSAS CORP0 citations52
US9601398B2Mar 21, 2017
Thin wafer handling and known good die test method
INVENSAS CORP1 citations52
APPLE INC
4 patentsUS9633974B2Apr 25, 2017
System in package fan out stacking architecture and process flow
APPLE INC57 citations98
US9659907B2May 23, 2017
Double side mounting memory integration in thin low warpage fanout package
APPLE INC26 citations94
US9236355B2Jan 12, 2016
EMI shielded wafer level fan-out pop package
APPLE INC7 citations83
US10181455B2Jan 15, 2019
3D thin profile pre-stacking architecture using reconstitution method
APPLE INC6 citations73
CHAU ELLIS
3 patentsSAMSUNG ELECTRONICS CO LTD
3 patentsUS7692314B2Apr 6, 2010
Wafer level chip scale package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations90
US7777308B2Aug 17, 2010
Integrated circuit packages including sinuous lead frames
SAMSUNG ELECTRONICS CO LTD6 citations61
US7884487B2Feb 8, 2011
Rotation joint and semiconductor device having the same
SAMSUNG ELECTRONICS CO LTD3 citations60