Inventor

HUANG BARON

TW2 patents

Patents

2 patents

US10968348B2Apr 6, 2021

Laser-releasable bonding materials for 3-D IC applications

BREWER SCIENCE INC2 citations70

US9865490B2Jan 9, 2018

Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes

BREWER SCIENCE INC1 citations47