Inventor
HUANG HUI-YU
TW16 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HUI-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
10 patentsUS11792923B2Oct 17, 2023
Storage device for flexible circuit packages and carrier thereof
CHIPBOND TECHNOLOGY CORP1 citations61
US11177206B2Nov 16, 2021
Double-sided flexible circuit board and layout structure thereof
CHIPBOND TECHNOLOGY CORP0 citations59
US11234328B2Jan 25, 2022
Circuit board
CHIPBOND TECHNOLOGY CORP0 citations56
US12089326B2Sep 10, 2024
Double-sided flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations49
US11206735B2Dec 21, 2021
Flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations49
US12456673B2Oct 28, 2025
Flip chip package and substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations47
US12432849B2Sep 30, 2025
Flip-chip bonding structure and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations47
US11602047B2Mar 7, 2023
Circuit board tape and joining method thereof
CHIPBOND TECHNOLOGY CORP0 citations46
US12464639B2Nov 4, 2025
Semiconductor package having flow-guiding grooves and circuit board thereof
CHIPBOND TECHNOLOGY CORP0 citations41
US10880993B1Dec 29, 2020
Circuit board having a predetermined punch area and sheet separated from the same
CHIPBOND TECHNOLOGY CORP0 citations33