Inventor
JIA ZHAOWEI
CN27 patents
⚠️ This page may combine multiple inventors who share the name “JIA ZHAOWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACM RESEARCH SHANGHAI INC
24 patentsUS11581205B2Feb 14, 2023
Methods and system for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC2 citations73
US11257667B2Feb 22, 2022
Methods and apparatus for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC2 citations73
US11141762B2Oct 12, 2021
System for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC3 citations73
US11037804B2Jun 15, 2021
Methods and apparatus for cleaning substrates
ACM RESEARCH SHANGHAI INC2 citations73
US10910244B2Feb 2, 2021
Methods and system for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC2 citations73
US9496172B2Nov 15, 2016
Method for forming interconnection structures
ACM RESEARCH SHANGHAI INC4 citations73
US11967497B2Apr 23, 2024
Methods and apparatus for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC0 citations62
US11911808B2Feb 27, 2024
System for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC0 citations62
US11848217B2Dec 19, 2023
Methods and apparatus for cleaning substrates
ACM RESEARCH SHANGHAI INC0 citations62
US11752529B2Sep 12, 2023
Method for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC0 citations62
US11638937B2May 2, 2023
Methods and apparatus for cleaning substrates
ACM RESEARCH SHANGHAI INC0 citations62
US11633765B2Apr 25, 2023
System for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC0 citations62
US11469134B2Oct 11, 2022
Plating chuck
ACM RESEARCH SHANGHAI INC1 citations62
US11103898B2Aug 31, 2021
Methods and apparatus for cleaning substrates
ACM RESEARCH SHANGHAI INC0 citations62
US12573019B2Mar 10, 2026
Electroplating chamber leakage plating warning method and system
ACM RESEARCH SHANGHAI INC0 citations59
US12486590B2Dec 2, 2025
Substrate processing method
ACM RESEARCH SHANGHAI INC0 citations59
US10453743B2Oct 22, 2019
Barrier layer removal method and semiconductor structure forming method
ACM RESEARCH SHANGHAI INC1 citations58
US10615073B2Apr 7, 2020
Method for removing barrier layer for minimizing sidewall recess
ACM RESEARCH SHANGHAI INC0 citations52
US11926920B2Mar 12, 2024
Electroplating apparatus and electroplating method
ACM RESEARCH SHANGHAI INC0 citations51
US11008669B2May 18, 2021
Apparatus for holding a substrate
ACM RESEARCH SHANGHAI INC0 citations51
US9633833B2Apr 25, 2017
Methods and apparatus for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC1 citations50
US11859303B2Jan 2, 2024
Plating apparatus
ACM RESEARCH SHANGHAI INC0 citations49
US10020208B2Jul 10, 2018
Methods and apparatus for cleaning semiconductor wafers
ACM RESEARCH SHANGHAI INC0 citations49
US10217662B2Feb 26, 2019
Method for processing interconnection structure for minimizing barrier sidewall recess
ACM RESEARCH SHANGHAI INC0 citations41