Inventor
BITZ BRADLEY R
US12 patents
Patents
12 patentsUS10916487B2Feb 9, 2021
Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant
MICRON TECHNOLOGY INC5 citations83
US10424531B2Sep 24, 2019
Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant
MICRON TECHNOLOGY INC5 citations83
US9960150B2May 1, 2018
Semiconductor device assembly with through-mold cooling channel formed in encapsulant
MICRON TECHNOLOGY INC5 citations83
US10074633B2Sep 11, 2018
Semiconductor die assemblies having molded underfill structures and related technology
MICRON TECHNOLOGY INC2 citations72
US11004828B2May 11, 2021
Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices
MICRON TECHNOLOGY INC2 citations68
US11749666B2Sep 5, 2023
Semiconductor die assemblies having molded underfill structures and related technology
MICRON TECHNOLOGY INC0 citations62
US11688664B2Jun 27, 2023
Semiconductor device assembly with through-mold cooling channel formed in encapsulant
MICRON TECHNOLOGY INC0 citations62
US12543607B2Feb 3, 2026
Separation method and assembly for chip-on-wafer processing
MICRON TECHNOLOGY INC0 citations61
US11676955B2Jun 13, 2023
Separation method and assembly for chip-on-wafer processing
MICRON TECHNOLOGY INC0 citations61
US12207411B2Jan 21, 2025
Printed wiring boards, printed wiring board assemblies, and electronic systems
MICRON TECHNOLOGY INC0 citations51
US10804256B2Oct 13, 2020
Semiconductor die assemblies having molded underfill structures and related technology
MICRON TECHNOLOGY INC0 citations51
US12564051B2Feb 24, 2026
Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems
MICRON TECHNOLOGY INC0 citations49