Inventor

NAKAMURA NAOFUMI

JP56 patents

⚠️ This page may combine multiple inventors who share the name “NAKAMURA NAOFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKAMURA NAOFUMI

TOSHIBA KK

Nonvolatile semiconductor memory device and method of manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device manufacturing method and semiconductor device

Semiconductor device having multi-layer interconnection structure and method of manufacturing the same

Nonvolatile semiconductor memory device and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device manufacturing method and semiconductor device

Manufacturing method of semiconductor devices by using dry etching technology

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor devices by using dry etching technology

Semiconductor device and manufacturing method of the same

Semiconductor device having oxidized metal film and manufacture method of the same

Semiconductor device having oxidized metal film and manufacture method of the same

MEMS device

Manufacturing method of semiconductor device

MEMS element

Pressure sensor

Sensor with fixed and movble components

Sensor

Microanalysis chip

Electronic device using MEMS technology

Electronic device and method of manufacturing the same

Device and method of manufacturing the same

Semiconductor device and method of fabricating same

Pressure sensor

Semiconductor micro-analysis chip and method of manufacturing the same

Semiconductor analysis chip and particle inspection method

Particle inspection system and driving method employed therein

Analysis package for detecting particles in a sample liquid

Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board

NISSHIN STEEL CO LTD

Dowel forming method for buckle base member

Formed material manufacturing method

Molded material production method and molded material

Formed material manufacturing method

Molded material production method and molded material

Formed material manufacturing method and surface treated metal plate used in same

Formed material manufacturing method and surface treated metal plate used in same

Formed material manufacturing method and formed material

Method of manufacturing molded material, and said molded material

Method for manufacturing molded member

FUJITSU LTD

Semiconductor device and method of producing the same

KABUSHIKI KAIHSA TOSHIBA

Semiconductor device having oxidized metal film and manufacture method of the same

TOKYO GAS CO LTD

Element-isolated hydrogen-terminated diamond semiconductor device and its manufacturing method

WADA MAKOTO

Nonvolatile semiconductor memory device and method of manufacturing the same

WADA JUNICHI

Semiconductor device having oxidized metal film and manufacture method of the same

YAMAHA CORP

Method for manufacturing a shadow mask of a Fe-Ni alloy

YAMAHA METANIX

Fe-ni-co alloy for a shadow mask

NIPPON STEEL CORP

Surface-treated steel sheet part having cut end surface, and cutting method therefor