Inventor
NAMISHIA DANIEL
US15 patents
⚠️ This page may combine multiple inventors who share the name “NAMISHIA DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CREE INC
10 patentsUS9812338B2Nov 7, 2017
Encapsulation of advanced devices using novel PECVD and ALD schemes
CREE INC8 citations83
US9761439B2Sep 12, 2017
PECVD protective layers for semiconductor devices
CREE INC2 citations72
US9202703B2Dec 1, 2015
Ni-rich Schottky contact
CREE INC5 citations72
US10886189B2Jan 5, 2021
Semiconductor die with improved ruggedness
CREE INC1 citations71
US10332817B1Jun 25, 2019
Semiconductor die with improved ruggedness
CREE INC3 citations71
US9934983B2Apr 3, 2018
Stress mitigation for thin and thick films used in semiconductor circuitry
CREE INC2 citations68
US12598994B2Apr 7, 2026
Multilayer encapsulation for humidity robustness and related fabrication methods
CREE INC0 citations61
US11842937B2Dec 12, 2023
Encapsulation stack for improved humidity performance and related fabrication methods
CREE INC1 citations57
US10068834B2Sep 4, 2018
Floating bond pad for power semiconductor devices
CREE INC0 citations49
US9269662B2Feb 23, 2016
Using stress reduction barrier sub-layers in a semiconductor die
CREE INC0 citations41
WOLFSPEED INC
3 patentsUS11842997B2Dec 12, 2023
Methods for pillar connection on frontside and passive device integration on backside of die
WOLFSPEED INC0 citations61
US11769768B2Sep 26, 2023
Methods for pillar connection on frontside and passive device integration on backside of die
WOLFSPEED INC0 citations61
US11587842B2Feb 21, 2023
Semiconductor die with improved ruggedness
WOLFSPEED INC0 citations61