Inventor
FENG JINGBIN
US34 patents
⚠️ This page may combine multiple inventors who share the name “FENG JINGBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
14 patentsUS6193859B1Feb 27, 2001
Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
NOVELLUS SYSTEMS INC159 citations98
US6159354ADec 12, 2000
Electric potential shaping method for electroplating
NOVELLUS SYSTEMS INC182 citations98
US6713122B1Mar 30, 2004
Methods and apparatus for airflow and heat management in electroless plating
NOVELLUS SYSTEMS INC44 citations95
US9309604B2Apr 12, 2016
Method and apparatus for electroplating
NOVELLUS SYSTEMS INC18 citations92
US7690324B1Apr 6, 2010
Small-volume electroless plating cell
NOVELLUS SYSTEMS INC21 citations90
US6967174B1Nov 22, 2005
Wafer chuck for use in edge bevel removal of copper from silicon wafers
NOVELLUS SYSTEMS INC23 citations90
US9677188B2Jun 13, 2017
Electrofill vacuum plating cell
NOVELLUS SYSTEMS INC8 citations84
US9988734B2Jun 5, 2018
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC6 citations83
US10351968B2Jul 16, 2019
Front referenced anode
NOVELLUS SYSTEMS INC1 citations72
US10435807B2Oct 8, 2019
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC5 citations71
US12157950B2Dec 3, 2024
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC0 citations62
US11512408B2Nov 29, 2022
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC1 citations62
US9340893B2May 17, 2016
Front referenced anode
NOVELLUS SYSTEMS INC2 citations62
US10053792B2Aug 21, 2018
Plating cup with contoured cup bottom
NOVELLUS SYSTEMS INC0 citations51
LAM RES CORP
9 patentsUS9816194B2Nov 14, 2017
Control of electrolyte flow dynamics for uniform electroplating
LAM RES CORP8 citations84
US10927475B2Feb 23, 2021
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP4 citations82
US9945044B2Apr 17, 2018
Method for uniform flow behavior in an electroplating cell
LAM RES CORP2 citations72
US11859300B2Jan 2, 2024
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP2 citations71
US11401623B2Aug 2, 2022
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP3 citations71
US12392049B2Aug 19, 2025
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP0 citations61
US10969036B2Apr 6, 2021
High flow multi-way piston valve for deposition systems
LAM RES CORP0 citations51
US10711364B2Jul 14, 2020
Uniform flow behavior in an electroplating cell
LAM RES CORP0 citations51
US12532718B2Jan 20, 2026
Improving substrate wettability for plating operations
LAM RES CORP0 citations49
FENG JINGBIN
5 patentsUS9228270B2Jan 5, 2016
Lipseals and contact elements for semiconductor electroplating apparatuses
FENG JINGBIN16 citations88
US9028657B2May 12, 2015
Front referenced anode
FENG JINGBIN5 citations83
US8475637B2Jul 2, 2013
Electroplating apparatus with vented electrolyte manifold
FENG JINGBIN14 citations83
US8172646B2May 8, 2012
Magnetically actuated chuck for edge bevel removal
FENG JINGBIN16 citations82
USD668211SOct 2, 2012
Segmented electroplating anode and anode segment
FENG JINGBIN6 citations79