Inventor
GHONGADI SHANTINATH
US41 patents
⚠️ This page may combine multiple inventors who share the name “GHONGADI SHANTINATH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
19 patentsUS9816194B2Nov 14, 2017
Control of electrolyte flow dynamics for uniform electroplating
LAM RES CORP8 citations84
US10011917B2Jul 3, 2018
Control of current density in an electroplating apparatus
LAM RES CORP5 citations83
US9735035B1Aug 15, 2017
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
LAM RES CORP7 citations83
US10927475B2Feb 23, 2021
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP4 citations82
US9677190B2Jun 13, 2017
Membrane design for reducing defects in electroplating systems
LAM RES CORP7 citations82
US10689774B2Jun 23, 2020
Control of current density in an electroplating apparatus
LAM RES CORP1 citations72
US10214829B2Feb 26, 2019
Control of current density in an electroplating apparatus
LAM RES CORP3 citations72
US10214828B2Feb 26, 2019
Control of current density in an electroplating apparatus
LAM RES CORP3 citations72
US11859300B2Jan 2, 2024
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP2 citations71
US11401623B2Aug 2, 2022
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP3 citations71
US11225727B2Jan 18, 2022
Control of current density in an electroplating apparatus
LAM RES CORP0 citations62
US12392049B2Aug 19, 2025
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP0 citations61
US10497592B2Dec 3, 2019
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
LAM RES CORP1 citations61
US11208732B2Dec 28, 2021
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP0 citations58
US10443146B2Oct 15, 2019
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP1 citations58
US12105039B2Oct 1, 2024
Systems and methods for in-situ measurement of sheet resistance on substrates
LAM RES CORP0 citations53
US10358738B2Jul 23, 2019
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step
LAM RES CORP0 citations51
US12532718B2Jan 20, 2026
Improving substrate wettability for plating operations
LAM RES CORP0 citations49
US12189369B2Jan 7, 2025
In-situ sensor-fusion with artificial intelligence
LAM RES CORP0 citations47
NOVELLUS SYSTEMS INC
14 patentsUS8377268B2Feb 19, 2013
Electroplating cup assembly
NOVELLUS SYSTEMS INC19 citations92
US7985325B2Jul 26, 2011
Closed contact electroplating cup assembly
NOVELLUS SYSTEMS INC36 citations92
US7935231B2May 3, 2011
Rapidly cleanable electroplating cup assembly
NOVELLUS SYSTEMS INC36 citations92
US9988734B2Jun 5, 2018
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC6 citations83
US9685353B2Jun 20, 2017
Apparatus and method for edge bevel removal of copper from silicon wafers
NOVELLUS SYSTEMS INC8 citations83
US9587322B2Mar 7, 2017
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
NOVELLUS SYSTEMS INC6 citations83
US10968531B2Apr 6, 2021
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
NOVELLUS SYSTEMS INC1 citations72
US10351968B2Jul 16, 2019
Front referenced anode
NOVELLUS SYSTEMS INC1 citations72
US12157950B2Dec 3, 2024
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC0 citations62
US11512408B2Nov 29, 2022
Lipseals and contact elements for semiconductor electroplating apparatuses
NOVELLUS SYSTEMS INC1 citations62
US9340893B2May 17, 2016
Front referenced anode
NOVELLUS SYSTEMS INC2 citations62
US10745817B2Aug 18, 2020
Configuration and method of operation of an electrodeposition system for improved process stability and performance
NOVELLUS SYSTEMS INC0 citations51
US10053792B2Aug 21, 2018
Plating cup with contoured cup bottom
NOVELLUS SYSTEMS INC0 citations51
US9816196B2Nov 14, 2017
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
NOVELLUS SYSTEMS INC1 citations48