Inventor
HE ZHIAN
US37 patents
⚠️ This page may combine multiple inventors who share the name “HE ZHIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
17 patentsUS9816194B2Nov 14, 2017
Control of electrolyte flow dynamics for uniform electroplating
LAM RES CORP8 citations84
US9670588B2Jun 6, 2017
Anisotropic high resistance ionic current source (AHRICS)
LAM RES CORP10 citations84
US10011917B2Jul 3, 2018
Control of current density in an electroplating apparatus
LAM RES CORP5 citations83
US9481942B2Nov 1, 2016
Geometry and process optimization for ultra-high RPM plating
LAM RES CORP9 citations83
US10927475B2Feb 23, 2021
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP4 citations82
US9909228B2Mar 6, 2018
Method and apparatus for dynamic current distribution control during electroplating
LAM RES CORP3 citations73
US10689774B2Jun 23, 2020
Control of current density in an electroplating apparatus
LAM RES CORP1 citations72
US10214828B2Feb 26, 2019
Control of current density in an electroplating apparatus
LAM RES CORP3 citations72
US10214829B2Feb 26, 2019
Control of current density in an electroplating apparatus
LAM RES CORP3 citations72
US11859300B2Jan 2, 2024
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP2 citations71
US11401623B2Aug 2, 2022
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP3 citations71
US11225727B2Jan 18, 2022
Control of current density in an electroplating apparatus
LAM RES CORP0 citations62
US10301739B2May 28, 2019
Anisotropic high resistance ionic current source (AHRICS)
LAM RES CORP1 citations62
US12392049B2Aug 19, 2025
Controlling plating electrolyte concentration on an electrochemical plating apparatus
LAM RES CORP0 citations61
US10358738B2Jul 23, 2019
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step
LAM RES CORP0 citations51
US12532718B2Jan 20, 2026
Improving substrate wettability for plating operations
LAM RES CORP0 citations49
US12180607B2Dec 31, 2024
Electrochemical deposition system including optical probes
LAM RES CORP0 citations43
NOVELLUS SYSTEMS INC
8 patentsUS9309604B2Apr 12, 2016
Method and apparatus for electroplating
NOVELLUS SYSTEMS INC18 citations92
US8377268B2Feb 19, 2013
Electroplating cup assembly
NOVELLUS SYSTEMS INC19 citations92
US7985325B2Jul 26, 2011
Closed contact electroplating cup assembly
NOVELLUS SYSTEMS INC36 citations92
US10351968B2Jul 16, 2019
Front referenced anode
NOVELLUS SYSTEMS INC1 citations72
US10023970B2Jul 17, 2018
Dynamic current distribution control apparatus and method for wafer electroplating
NOVELLUS SYSTEMS INC4 citations72
US9822461B2Nov 21, 2017
Dynamic current distribution control apparatus and method for wafer electroplating
NOVELLUS SYSTEMS INC4 citations72
US9340893B2May 17, 2016
Front referenced anode
NOVELLUS SYSTEMS INC2 citations62
US10053792B2Aug 21, 2018
Plating cup with contoured cup bottom
NOVELLUS SYSTEMS INC0 citations51