Inventor

TRAN MINH QUOC

US18 patents

⚠️ This page may combine multiple inventors who share the name “TRAN MINH QUOC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TRAN MINH QUOC

ADVANCED MICRO DEVICES INC

Graphoepitaxial conductor cores in integrated circuit interconnects

Method and system for polishing a semiconductor wafer

Sealing sidewall pores in low-k dielectrics

Plating system with secondary ring anode for a semiconductor wafer

Ultra low dielectric constant integrated circuit system

Method of manufacturing an amorphized barrier layer for integrated circuit interconnects

Amorphized barrier layer for integrated circuit interconnects

Imaging of integrated circuit interconnects

Method for forming dual damascene interconnect structure

Electro-chemical metal alloying for semiconductor manufacturing

Atomic layer barrier layer for integrated circuit interconnects

Pre-fill CMP and electroplating method for integrated circuits

Plating system with remote secondary anode for semiconductor manufacturing

Plating system with shielded secondary anode for semiconductor manufacturing

Interconnect with multiple layers of conductive material with grain boundary between the layers

Heat/cold amorphized barrier layer for integrated circuit interconnects

NICKEL ALEXANDER H

Low-H plasma treatment with N2 anneal for electronic memory devices

APPLIED MATERIALS INC

Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber