Inventor
KAWATANI NORIO
JP6 patents
Patents
6 patentsUS4733462AMar 29, 1988
Apparatus for positioning circuit components at predetermined positions and method therefor
SONY CORP59 citations94
US5698068ADec 16, 1997
Thermocompression bonding equipment
SONY CORP32 citations92
US5439161AAug 8, 1995
Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device
SONY CORP50 citations92
US7251883B2Aug 7, 2007
Electronic-component alignment method and apparatus therefor
SONY CORP17 citations89
US7594319B2Sep 29, 2009
Electronic-component alignment method
SONY CORP10 citations81
US5683026ANov 4, 1997
Pressure-bonding unit and pressure-bonding head unit
SONY CORP10 citations72