Inventor
KOSHIMIZU HIDEKI
JP4 patents
Patents
4 patentsUS10269639B2Apr 23, 2019
Method of manufacturing packaged wafer
DISCO CORP4 citations69
US9892986B2Feb 13, 2018
Packaged wafer manufacturing method and device chip manufacturing method
DISCO CORP3 citations69
US9716040B2Jul 25, 2017
Wafer processing method using adhesive tape to pick up device chips
DISCO CORP6 citations68
US10312144B2Jun 4, 2019
Method of dividing a wafer by back grinding
DISCO CORP1 citations58