Inventor

EICHELBERGER CHARLES W

US128 patents

⚠️ This page may combine multiple inventors who share the name “EICHELBERGER CHARLES W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EICHELBERGER CHARLES W

GEN ELECTRIC

Compact high density interconnect structure

Method for packaging integrated circuit chips employing a polymer film overlay layer

Multichip integrated circuit packaging method

Laser beam scanning method for forming via holes in polymer materials

Adaptive lithography system to provide high density interconnect

Multichip integrated circuit packaging configuration and method

Excimer laser patterning of a novel resist

Capacitive touch entry apparatus having high degree of personal safety

Programmable energy load controller system and methods

Method for interconnecting a stack of integrated circuits at a very high density

Hermetic high density interconnected electronic system

HDI impedance matched microwave circuit assembly

High density interconnect structure including a chamber

High density interconnect structure with top mounted components

Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG &#39;s

Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it

Direct patterning of metals over a thermally inefficient surface using a laser

High density interconnect with high volumetric efficiency

Die attachment method using nonconductive adhesive for use in high density interconnected assemblies

Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer

Multi-chip interconnection package

Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer

Simplified method for repair of high density interconnect circuits

Integrated circuit packaging configuration for rapid customized design and unique test capability

Excimer laser patterning of a novel resist using masked and maskless process steps

Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging

Television frame synchronizer with independently controllable input/output rates

Electrical conductor

Cooking apparatus employing a rotisserie mode with stationary food

Cooking apparatus having internal pressurizing source and _integral heat source _

Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal

Method and apparatus for controlling distributed electrical loads

Load control processor

EPIC TECHNOLOGIES INC

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Compliant, solderable input/output bump structures

Compliant, solderable input/output bump structures

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated circuit structures and methods employing a low modulus high elongation photodielectric

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Electroless metal connection structures and methods

EICHELBERGER CHARLES W

Three-dimensional multichip module systems

Configuration for testing and burn-in of integrated circuit chips

Method of fabricating a base layer circuit structure

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

INTEGRATED SYSTEM ASSEMBLIES

Multichip integrated circuit modules

Apparatus and method for positioning an integrated circuit chip within a multichip module

Methods for testing and burn-in of integrated circuit chips

MARTIN MARIETTA CORP

Flexible high density interconnect structure and flexibly interconnected system

Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's