Inventor
SATHE AJIT V
US10 patents
⚠️ This page may combine multiple inventors who share the name “SATHE AJIT V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS6840777B2Jan 11, 2005
Solderless electronics packaging
INTEL CORP68 citations97
US6661660B2Dec 9, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP72 citations95
US6639799B2Oct 28, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP67 citations95
US6535386B2Mar 18, 2003
Electronic assembly having a heat pipe that conducts heat from a semiconductor die
INTEL CORP78 citations94
US7253523B2Aug 7, 2007
Reworkable thermal interface material
INTEL CORP28 citations92
US7159313B2Jan 9, 2007
Solderless electronics packaging and methods of manufacture
INTEL CORP23 citations92
US6903278B2Jun 7, 2005
Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate
INTEL CORP27 citations92
US6800947B2Oct 5, 2004
Flexible tape electronics packaging
INTEL CORP26 citations92
US7589395B2Sep 15, 2009
Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation
INTEL CORP1 citations51