Inventor
DAHILIG FREDERICK R
SG10 patents
⚠️ This page may combine multiple inventors who share the name “DAHILIG FREDERICK R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CAMACHO ZIGMUND R
6 patentsUS8884418B2Nov 11, 2014
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
CAMACHO ZIGMUND R15 citations92
US8241954B2Aug 14, 2012
Wafer level die integration and method
CAMACHO ZIGMUND R9 citations84
US8283209B2Oct 9, 2012
Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps
CAMACHO ZIGMUND R7 citations83
US8105915B2Jan 31, 2012
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
CAMACHO ZIGMUND R12 citations83
US9142514B2Sep 22, 2015
Semiconductor device and method of forming wafer level die integration
CAMACHO ZIGMUND R4 citations73
US8890328B2Nov 18, 2014
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
CAMACHO ZIGMUND R0 citations51
STATS CHIPPAC LTD
3 patentsUSRE47923EMar 31, 2020
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
STATS CHIPPAC LTD0 citations52
US9666540B2May 30, 2017
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
STATS CHIPPAC LTD0 citations52
US9257357B2Feb 9, 2016
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
STATS CHIPPAC LTD0 citations52