Inventor

Chua Kok Yau

MY18 patents

⚠️ This page may combine multiple inventors who share the name “Chua Kok Yau”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Chua Kok Yau

INFINEON TECHNOLOGIES AG

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

Semiconductor package with plateable encapsulant and a method for manufacturing the same

Semiconductor package with air cavity

Over-under sensor packaging with sensor spaced apart from control chip

Package with acoustic sensing device(s) and millimeter wave sensing elements

Micro-electrical mechanical system sensor package and method of manufacture thereof

Manufacturing a package using plateable encapsulant

Pressure sensor having a lidless/laminate structure

Package with clip having through hole accommodating component-related structure

Device having substrate with conductive pillars

Device having substrate with conductive pillars

Over-under sensor packaging with sensor spaced apart from control chip

Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening

Molded cavity package with embedded conductive layer and enhanced sealing

INFINEON TECHNOLOGIES AUSTRIA AG

Voltage regulator module with inductor-cooled power stage

Leadframe, semiconductor package and method

Voltage regulator module having a power stage

Semiconductor package having a laser-activatable mold compound