Inventor

NG CHEE YANG

MY22 patents

⚠️ This page may combine multiple inventors who share the name “NG CHEE YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NG CHEE YANG

INFINEON TECHNOLOGIES AG

Semiconductor package with a through port for sensor applications

Semiconductor device and a method for forming a semiconductor device

Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier

Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement

Over-under sensor packaging with sensor spaced apart from control chip

Package with acoustic sensing device(s) and millimeter wave sensing elements

Semiconductor package having a chip carrier with a pad offset feature

Hybrid embedded package

Hybrid embedded package

Device having substrate with conductive pillars

Device having substrate with conductive pillars

Semiconductor chip with electrically conducting layer

Over-under sensor packaging with sensor spaced apart from control chip

Stacked transistor chip package with source coupling

Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation

Molded cavity package with embedded conductive layer and enhanced sealing

Semiconductor package with air gap

Integrated passives package, semiconductor module and method of manufacturing

Semiconductor package having a filled conductive cavity

INFINEON TECHNOLOGIES AUSTRIA AG

Voltage regulator module with inductor-cooled power stage

Dipped coated electronic module assembly with enhanced thermal distribution

Semiconductor package having a laser-activatable mold compound