Inventor
JANG AENEE
KR12 patents
Patents
12 patentsUS12237290B2Feb 25, 2025
Semiconductor packages and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations72
US11862613B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US11581234B2Feb 14, 2023
Semiconductor package with improved heat dissipation
SAMSUNG ELECTRONICS CO LTD2 citations70
US12347819B2Jul 1, 2025
Semiconductor package having stacked semiconductor chips
SAMSUNG ELECTRONICS CO LTD1 citations62
US12341074B2Jun 24, 2025
Semiconductor package with increased thermal dissipation
SAMSUNG ELECTRONICS CO LTD0 citations60
US12191238B2Jan 7, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11810898B2Nov 7, 2023
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11600601B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11594516B2Feb 28, 2023
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11581248B2Feb 14, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations60
US12588567B2Mar 24, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12581664B2Mar 17, 2026
Semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations40