Inventor

TSENG HUA-WEI

TW22 patents

⚠️ This page may combine multiple inventors who share the name “TSENG HUA-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG HUA-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Pop devices and methods of forming the same

Package structure, die and method of manufacturing the same

Semiconductor package structure and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Package structure and method of forming the same

PoP device and method of forming the same

Package structure including IPD and method of forming the same

Air channel formation in packaging process

Semiconductor package and method of manufacturing the same

Method for manufacturing semiconductor package structure

Package structure and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Semiconductor package dielectric susbtrate including a trench

Semiconductor package dielectric substrate including a trench

Package structure and method of forming the same

Package structure including IPD and method of forming the same

Air channel formation in packaging process

Air channel formation in packaging process

Edge profile control of integrated circuit chips

Semiconductor package, package on package structure and method of froming package on package structure

Package structure and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Package structure and method of forming the same