Inventor

LIM THIAM BENG

SG9 patents

⚠️ This page may combine multiple inventors who share the name “LIM THIAM BENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INST OF MICROELECTRONICS

6 patents

US5925934AJul 20, 1999

Low cost and highly reliable chip-sized package

INST OF MICROELECTRONICS181 citations97

US5893724AApr 13, 1999

Method for forming a highly reliable and planar ball grid array package

INST OF MICROELECTRONICS57 citations94

US5892290AApr 6, 1999

Highly reliable and planar ball grid array package

INST OF MICROELECTRONICS55 citations94

US6540866B1Apr 1, 2003

Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

INST OF MICROELECTRONICS49 citations92

US6621151B1Sep 16, 2003

Lead frame for an integrated circuit chip

INST OF MICROELECTRONICS2 citations57

US6583501B2Jun 24, 2003

Lead frame for an integrated circuit chip (integrated circuit peripheral support)

INST OF MICROELECTRONICS0 citations45

INST OF MICROELECTRONICS NATIO

1 patent

US5773878AJun 30, 1998

IC packaging lead frame for reducing chip stress and deformation

INST OF MICROELECTRONICS NATIO108 citations95

UNIV SINGAPORE

1 patent

US6537411B1Mar 25, 2003

Method for low temperature lamination of metals to polyimides

UNIV SINGAPORE37 citations89

NAT UNIVERSITY OF SINGAPORE AN

1 patent

US6334926B1Jan 1, 2002

Method for low temperature lamination of metals to fluoropolymers

NAT UNIVERSITY OF SINGAPORE AN16 citations76