Inventor
HUSSEIN MAKAREM A
US28 patents
⚠️ This page may combine multiple inventors who share the name “HUSSEIN MAKAREM A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
20 patentsUS6365529B1Apr 2, 2002
Method for patterning dual damascene interconnects using a sacrificial light absorbing material
INTEL CORP121 citations98
US6169024B1Jan 2, 2001
Process to manufacture continuous metal interconnects
INTEL CORP90 citations98
US6329118B1Dec 11, 2001
Method for patterning dual damascene interconnects using a sacrificial light absorbing material
INTEL CORP107 citations97
US5714413AFeb 3, 1998
Method of making a transistor having a deposited dual-layer spacer structure
INTEL CORP117 citations97
US6981380B2Jan 3, 2006
Thermoelectric cooling for microelectronic packages and dice
INTEL CORP51 citations96
US6037255AMar 14, 2000
Method for making integrated circuit having polymer interlayer dielectric
INTEL CORP55 citations95
US7649239B2Jan 19, 2010
Dielectric spacers for metal interconnects and method to form the same
INTEL CORP22 citations92
US6406995B1Jun 18, 2002
Pattern-sensitive deposition for damascene processing
INTEL CORP72 citations92
US6908829B2Jun 21, 2005
Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines
INTEL CORP34 citations91
US6649515B2Nov 18, 2003
Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structures
INTEL CORP35 citations89
US7071554B2Jul 4, 2006
Stress mitigation layer to reduce under bump stress concentration
INTEL CORP16 citations84
US6774037B2Aug 10, 2004
Method integrating polymeric interlayer dielectric in integrated circuits
INTEL CORP18 citations80
US7923760B2Apr 12, 2011
Dielectric spacers for metal interconnects and method to form the same
INTEL CORP5 citations74
US7157380B2Jan 2, 2007
Damascene process for fabricating interconnect layers in an integrated circuit
INTEL CORP9 citations74
US6720631B2Apr 13, 2004
Transistor having a deposited dual-layer spacer structure
INTEL CORP7 citations72
US7166922B1Jan 23, 2007
Continuous metal interconnects
INTEL CORP2 citations63
US7078754B2Jul 18, 2006
Methods and apparatuses for producing a polymer memory device
INTEL CORP4 citations62
US6900063B2May 31, 2005
Methods and apparatuses for producing a polymer memory device
INTEL CORP2 citations62
US7659196B2Feb 9, 2010
Soluble hard mask for interlayer dielectric patterning
INTEL CORP3 citations56
US7326981B2Feb 5, 2008
Methods and apparatuses for producing a polymer memory device
INTEL CORP0 citations51
LUXNOUR TECH INC
4 patentsUS11387029B2Jul 12, 2022
Apparatus for transferring plurality of micro devices and methods of fabrication
LUXNOUR TECH INC2 citations67
US12260989B2Mar 25, 2025
Methods of transferring micro light emitting diode devices using electromagnetic apparatus and methods of fabrication
LUXNOUR TECH INC0 citations56
US11056363B2Jul 6, 2021
Electromagnetic tool for transferring micro devices and methods of transfer
LUXNOUR TECH INC0 citations46
US10984937B2Apr 20, 2021
Electromagnetic tool for transferring micro devices and methods of fabrication
LUXNOUR TECH INC0 citations46