Inventor
FANG CHEE HONG
MY3 patents
Patents
3 patentsUS9219025B1Dec 22, 2015
Molded flip-clip semiconductor package
INFINEON TECHNOLOGIES AG12 citations80
US10490470B2Nov 26, 2019
Semiconductor package and method for fabricating a semiconductor package
INFINEON TECHNOLOGIES AG0 citations42
US10099411B2Oct 16, 2018
Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips
INFINEON TECHNOLOGIES AG0 citations35