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Inventor
MOBLEY STEPHEN
US
2 patents
Patents
2 patents
US10103080B2
Oct 16, 2018
Thermally enhanced semiconductor package with thermal additive and process for making the same
QORVO US INC
4 citations
71
US10262915B2
Apr 16, 2019
Thermally enhanced semiconductor package with thermal additive and process for making the same
QORVO US INC
0 citations
50