Inventor
SUDA RYUTARO
JP18 patents
Patents
18 patentsUS11615964B2Mar 28, 2023
Etching method
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US11551937B2Jan 10, 2023
Etching method
TOKYO ELECTRON LTD2 citations72
US12341020B2Jun 24, 2025
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations62
US12198938B2Jan 14, 2025
Etching method
TOKYO ELECTRON LTD0 citations62
US12142484B2Nov 12, 2024
Etching method
TOKYO ELECTRON LTD0 citations62
US11600501B2Mar 7, 2023
Etching method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations62
US11482425B2Oct 25, 2022
Etching method and etching apparatus
TOKYO ELECTRON LTD0 citations62
US11361976B2Jun 14, 2022
Substrate processing method and plasma processing apparatus
TOKYO ELECTRON LTD1 citations62
US11342194B2May 24, 2022
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations62
US12368027B2Jul 22, 2025
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations61
US11094550B2Aug 17, 2021
Etching method and etching apparatus
TOKYO ELECTRON LTD0 citations61
US11171012B1Nov 9, 2021
Method and apparatus for formation of protective sidewall layer for bow reduction
TOKYO ELECTRON LTD0 citations60
US12580154B2Mar 17, 2026
Etching method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations58
US11456180B2Sep 27, 2022
Etching method
TOKYO ELECTRON LTD0 citations51
US12512325B2Dec 30, 2025
Etching method and etching apparatus
TOKYO ELECTRON LTD0 citations50
US12347651B2Jul 1, 2025
Etching method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations49
US11996296B2May 28, 2024
Substrate processing method and substrate processing system
TOKYO ELECTRON LTD0 citations48
US12560863B2Feb 24, 2026
Etching method and plasma processing system
TOKYO ELECTRON LTD0 citations47