Inventor

LEE BUM WOO

KR4 patents

⚠️ This page may combine multiple inventors who share the name “LEE BUM WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US8042593B2Oct 25, 2011

Semiconductor chip bonding apparatus

SAMSUNG ELECTRONICS CO LTD9 citations73

US6090220AJul 18, 2000

Method for transferring a wafer after removing a washing solution

SAMSUNG ELECTRONICS CO LTD5 citations51

LG CHEMICAL LTD

2 patents

US11327211B2May 10, 2022

Asymmetric transmission film

LG CHEMICAL LTD0 citations46

US10665472B2May 26, 2020

System and method for removing foreign substances by using electric field adsorption method

LG CHEMICAL LTD0 citations39