Inventor
WU GENE
US5 patents
⚠️ This page may combine multiple inventors who share the name “WU GENE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7838424B2Nov 23, 2010
Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching
TAIWAN SEMICONDUCTOR MFG84 citations96
US7830004B2Nov 9, 2010
Packaging with base layers comprising alloy 42
TAIWAN SEMICONDUCTOR MFG44 citations89
US7642129B2Jan 5, 2010
Ball-mounting method for coplanarity improvement in large package
TAIWAN SEMICONDUCTOR MFG3 citations60