Inventor
GILL BHARATJEET SINGH
CA12 patents
Patents
12 patentsUS9407215B2Aug 2, 2016
Circuits and methods related to low-noise amplifiers having improved linearity
SKYWORKS SOLUTIONS INC27 citations93
US10447210B2Oct 15, 2019
Flip chip amplifier for wireless device
SKYWORKS SOLUTIONS INC3 citations83
US10193504B2Jan 29, 2019
Solder bump placement for thermal management in flip chip amplifiers
SKYWORKS SOLUTIONS INC4 citations83
US10181824B2Jan 15, 2019
Solder bump placement for grounding in flip chip amplifiers
SKYWORKS SOLUTIONS INC4 citations83
US10177716B2Jan 8, 2019
Solder bump placement for emitter-ballasting in flip chip amplifiers
SKYWORKS SOLUTIONS INC5 citations83
US10069466B2Sep 4, 2018
Direct substrate to solder bump connection for thermal management in flip chip amplifiers
SKYWORKS SOLUTIONS INC7 citations83
US11515845B2Nov 29, 2022
Direct substrate to solder bump connection for thermal management in flip chip amplifiers
SKYWORKS SOLUTIONS INC1 citations72
US10790788B2Sep 29, 2020
Direct substrate to solder bump connection for thermal management in flip chip amplifiers
SKYWORKS SOLUTIONS INC2 citations72
US12418265B2Sep 16, 2025
Direct substrate to solder bump connection for thermal management in flip chip amplifiers
SKYWORKS SOLUTIONS INC0 citations62
US11652079B2May 16, 2023
Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances
SKYWORKS SOLUTIONS INC0 citations62
US11171110B2Nov 9, 2021
Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances
SKYWORKS SOLUTIONS INC0 citations62
US11621676B2Apr 4, 2023
Auto-linearizing amplifier
SKYWORKS SOLUTIONS INC1 citations61