Inventor
WONG TSE E
US11 patents
⚠️ This page may combine multiple inventors who share the name “WONG TSE E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
10 patentsUS5899753AMay 4, 1999
Spring-loaded ball contact connector
RAYTHEON CO41 citations88
US10446466B1Oct 15, 2019
Mechanically improved microelectronic thermal interface structure for low die stress
RAYTHEON CO15 citations85
US8921992B2Dec 30, 2014
Stacked wafer with coolant channels
RAYTHEON CO13 citations83
US7298235B2Nov 20, 2007
Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
RAYTHEON CO11 citations81
US7605477B2Oct 20, 2009
Stacked integrated circuit assembly
RAYTHEON CO11 citations80
US9648729B1May 9, 2017
Stress reduction interposer for ceramic no-lead surface mount electronic device
RAYTHEON CO6 citations67
US9334154B2May 10, 2016
Hermetically sealed package having stress reducing layer
RAYTHEON CO2 citations60
US7888176B2Feb 15, 2011
Stacked integrated circuit assembly
RAYTHEON CO4 citations59
US9708181B2Jul 18, 2017
Hermetically sealed package having stress reducing layer
RAYTHEON CO0 citations49
US9706662B2Jul 11, 2017
Adaptive interposer and electronic apparatus
RAYTHEON CO0 citations43