Inventor
KURASHIMA YOHEI
JP5 patents
Patents
5 patentsUS6812549B2Nov 2, 2004
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
SEIKO EPSON CORP157 citations98
US6608371B2Aug 19, 2003
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
SEIKO EPSON CORP243 citations98
US5735451AApr 7, 1998
Method and apparatus for bonding using brazing material
SEIKO EPSON CORP58 citations93
US6596634B2Jul 22, 2003
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
SEIKO EPSON CORP37 citations92
US6158648ADec 12, 2000
Method and apparatus for bonding using brazing material
SEIKO EPSON CORP39 citations90