P

Inventor

LEE I-TSENG

TW8 patents
⚠️ This page may combine multiple inventors who share the name “LEE I-TSENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VIA TECH INC

5 patents
US7078794B2Jul 18, 2006

Chip package and process for forming the same

VIA TECH INC26 citations90
US6946601B1Sep 20, 2005

Electronic package with passive components

VIA TECH INC34 citations88
US7248477B2Jul 24, 2007

Fan-shaped heat-dissipating device

VIA TECH INC3 citations61
US7143509B2Dec 5, 2006

Circuit board and processing method thereof

VIA TECH INC2 citations60
US6919628B2Jul 19, 2005

Stack chip package structure

VIA TECH INC6 citations59

ADVANCED MICRO DEVICES SHANGHAI CO LTD

1 patent
US9214438B2Dec 15, 2015

Die-die stacking structure and method for making the same

ADVANCED MICRO DEVICES SHANGHAI CO LTD3 citations60

ADVANCED MICRO DEVICES CO LTD SHANGHAI

1 patent
US8994191B2Mar 31, 2015

Die-die stacking structure and method for making the same

ADVANCED MICRO DEVICES CO LTD SHANGHAI1 citations44

ADVANCED MICRO DEVICES (SHANGHAI) CO LTD

1 patent
US9870969B2Jan 16, 2018

Substrate

ADVANCED MICRO DEVICES (SHANGHAI) CO LTD0 citations34