Inventor
MAGNO SHEILA RIMA C
SG9 patents
⚠️ This page may combine multiple inventors who share the name “MAGNO SHEILA RIMA C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
7 patentsUS6969640B1Nov 29, 2005
Air pocket resistant semiconductor package system
STATS CHIPPAC LTD56 citations95
US7556987B2Jul 7, 2009
Method of fabricating an integrated circuit with etched ring and die paddle
STATS CHIPPAC LTD24 citations92
US7148086B2Dec 12, 2006
Semiconductor package with controlled solder bump wetting and fabrication method therefor
STATS CHIPPAC LTD27 citations92
US7141886B2Nov 28, 2006
Air pocket resistant semiconductor package
STATS CHIPPAC LTD21 citations91
US7863108B2Jan 4, 2011
Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
STATS CHIPPAC LTD4 citations62
US7352055B2Apr 1, 2008
Semiconductor package with controlled solder bump wetting
STATS CHIPPAC LTD2 citations62
US7541222B2Jun 2, 2009
Wire sweep resistant semiconductor package and manufacturing method therefor
STATS CHIPPAC LTD5 citations61