Inventor

TSUI YAT KIT

HK5 patents

⚠️ This page may combine multiple inventors who share the name “TSUI YAT KIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSUI YAT KIT

2 patents

US8232626B2Jul 31, 2012

Via and method of via forming and method of via filling

TSUI YAT KIT7 citations79

US9117715B2Aug 25, 2015

Wafer-level device packaging

TSUI YAT KIT0 citations31

HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD

1 patent

US9713284B2Jul 18, 2017

Locally enhanced direct liquid cooling system for high power applications

HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD2 citations68

XIE BIN

1 patent

US8754507B2Jun 17, 2014

Forming through-silicon-vias for multi-wafer integrated circuits

XIE BIN3 citations57

YANG DAN

1 patent

US8823126B2Sep 2, 2014

Low cost backside illuminated CMOS image sensor package with high integration

YANG DAN0 citations34