Inventor

SUETSUGU KENICHIRO

US29 patents

⚠️ This page may combine multiple inventors who share the name “SUETSUGU KENICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUETSUGU KENICHIRO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Multiple fluid mixing apparatus

Solder, solder paste and soldering method

Solder alloy of electrode for joining electronic parts and soldering method

Solder, electronic component mounted by soldering, and electronic circuit board

Bonding film member and mounting method of electronic component

Image reading device having a light waveguide means widened toward an end nearest to an image surface

Image sensor having light guides for communication with image plane

Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method

Connection structure and electronic circuit board

Optical wave guide sheet comprising plurality of doubly-clad core members with light scatterers in outer cladding

Solder alloy of electrode for joining electronic parts and soldering method

Process for manufacturing a resin-encapsulated electronic product

Electronic circuit substrate

Method and apparatus for processing electronic parts

Solder, solder paste and soldering method

Optical waveguide and an image sensor using the same

Method of mounting electronics component

Flow soldering process and apparatus

Method of soldering using lead-free solder and bonded article prepared through soldering by the method

Bicycle frame

Mounting method of semiconductor device

Connecting material and connecting method

Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering

PANASONIC CORP

Soldering apparatus and soldering method

Method for recycling wastes of an electrical appliance

SAKATANI SHIGEAKI

Soldering material and electronic component assembly

UNIV HIROSHIMA

Solder material and connected structure

FURUSAWA AKIO

Bonding material, electronic component, bonding structure and electronic device

NAKAYA KIMIAKI

Flow soldering apparatus and flow soldering method using a water content sensor