Inventor
TANGPUZ CONSUELO N
PH12 patents
⚠️ This page may combine multiple inventors who share the name “TANGPUZ CONSUELO N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
11 patentsUS6720642B1Apr 13, 2004
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR137 citations98
US7215011B2May 8, 2007
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR65 citations97
US7154168B2Dec 26, 2006
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR64 citations97
US6943434B2Sep 13, 2005
Method for maintaining solder thickness in flipchip attach packaging processes
FAIRCHILD SEMICONDUCTOR133 citations97
US7501702B2Mar 10, 2009
Integrated transistor module and method of fabricating same
FAIRCHILD SEMICONDUCTOR17 citations92
US6989588B2Jan 24, 2006
Semiconductor device including molded wireless exposed drain packaging
FAIRCHILD SEMICONDUCTOR102 citations92
US6949410B2Sep 27, 2005
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR24 citations92
US6423623B1Jul 23, 2002
Low Resistance package for semiconductor devices
FAIRCHILD SEMICONDUCTOR78 citations92
US7682877B2Mar 23, 2010
Substrate based unmolded package
FAIRCHILD SEMICONDUCTOR3 citations74
US7582956B2Sep 1, 2009
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR3 citations62
US7842555B2Nov 30, 2010
Integrated transistor module and method of fabricating same
FAIRCHILD SEMICONDUCTOR1 citations51