Inventor
GUO SHUAI
CN39 patents
⚠️ This page may combine multiple inventors who share the name “GUO SHUAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHANGXIN MEMORY TECH INC
14 patentsUS11587949B1Feb 21, 2023
Method of manufacturing semiconductor structure and semiconductor structure
CHANGXIN MEMORY TECH INC6 citations75
US11508731B1Nov 22, 2022
Semiconductor structure and manufacturing method thereof
CHANGXIN MEMORY TECH INC3 citations73
US12302549B2May 13, 2025
Semiconductor memory structure
CHANGXIN MEMORY TECH INC0 citations52
US12051608B2Jul 30, 2024
Method for adjusting wafer deformation and semiconductor structure
CHANGXIN MEMORY TECH INC0 citations52
US12046472B2Jul 23, 2024
Method for manufacturing semiconductor structure
CHANGXIN MEMORY TECH INC0 citations52
US12014994B2Jun 18, 2024
Method for forming overlay marks and semiconductor structure
CHANGXIN MEMORY TECH INC0 citations52
US11935785B2Mar 19, 2024
Method of manufacturing a semiconductor structure, and a semiconductor structure
CHANGXIN MEMORY TECH INC0 citations52
US11864371B2Jan 2, 2024
Method for manufacturing semiconductor structure and semiconductor structure
CHANGXIN MEMORY TECH INC0 citations52
US11778804B2Oct 3, 2023
Capacitor array structure and fabrication method thereof
CHANGXIN MEMORY TECH INC0 citations52
US11626408B2Apr 11, 2023
Memory device and forming method thereof
CHANGXIN MEMORY TECH INC0 citations52
US12317503B2May 27, 2025
Memory device, and manufacturing method and driving method thereof
CHANGXIN MEMORY TECH INC0 citations48
US12218220B2Feb 4, 2025
Manufacturing method of semiconductor structure and semiconductor structure
CHANGXIN MEMORY TECH INC0 citations48
US12513885B2Dec 30, 2025
Method for forming semiconductor device and semiconductor device
CHANGXIN MEMORY TECH INC0 citations47
US12262522B2Mar 25, 2025
Method for fabricating semiconductor structure, semiconductor structure, and memory
CHANGXIN MEMORY TECH INC0 citations47
LENOVO BEIJING LTD
6 patentsUSD1001811SOct 17, 2023
Computer mainframe
LENOVO BEIJING LTD12 citations86
USD1030756SJun 11, 2024
Head mounted display device
LENOVO BEIJING LTD1 citations68
USD1107698SDec 30, 2025
Computer mainframe
LENOVO BEIJING LTD0 citations62
USD1089184SAug 19, 2025
Laptop computer
LENOVO BEIJING LTD0 citations62
USD1089215SAug 19, 2025
Computer mainframe
LENOVO BEIJING LTD0 citations62
USD1028978SMay 28, 2024
Head mounted display device
LENOVO BEIJING LTD0 citations58
YANGTZE MEMORY TECH CO LTD
5 patentsUS10529694B2Jan 7, 2020
Methods and systems for wafer bonding alignment compensation
YANGTZE MEMORY TECH CO LTD6 citations84
US10886256B2Jan 5, 2021
Methods and systems for wafer bonding alignment compensation
YANGTZE MEMORY TECH CO LTD4 citations73
US10553565B2Feb 4, 2020
Methods and systems for adjusting wafer deformation during wafer bonding
YANGTZE MEMORY TECH CO LTD5 citations73
US10679854B2Jun 9, 2020
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD2 citations65
US11342185B2May 24, 2022
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD0 citations55
MOBVOI INFORMATION TECH COMPANY LIMITED
3 patentsHENGDIAN GROUP DMEGC MAGNETICS CO LTD
3 patentsUS12520620B2Jan 6, 2026
Solar battery, method for preparing same and use thereof
HENGDIAN GROUP DMEGC MAGNETICS CO LTD0 citations58
US12237433B2Feb 25, 2025
Double-sided solar cell and preparation method therefor
HENGDIAN GROUP DMEGC MAGNETICS CO LTD0 citations46
US12369429B2Jul 22, 2025
All-black crystalline silicon solar cell and preparation method therefor, and photovoltaic module
HENGDIAN GROUP DMEGC MAGNETICS CO LTD0 citations45