Inventor
LIU MING-CHE
TW7 patents
Patents
7 patentsUS10026671B2Jul 17, 2018
Substrate design for semiconductor packages and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD27 citations94
US9564416B2Feb 7, 2017
Package structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations93
US9859267B2Jan 2, 2018
Package structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9691723B2Jun 27, 2017
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11424199B2Aug 23, 2022
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10522486B2Dec 31, 2019
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9929115B2Mar 27, 2018
Device with optimized thermal characteristics
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51